MEMS（微机电系统封装）产品具有体积小、重量轻、功耗低、灵敏度高、价格低、易批量生产等优点。
MEMS产品种类繁多，封装形式多样，产品应用范围广，随着科技的不断发展，与人类的日常生活关联越来越紧密。
MEMS产品类别：
01 声学类：硅麦克风
02 压力类：高度计，气压计，3Dtouch
03 惯性类：加速度计，陀螺仪，6lMU
04 光学类：接近光传感器，光电传感器，Vcsel，心率传感器，TOF
05 RFMEMS：滤波器（SAW&BAW）
06 磁传感器：AMR，TMR
07 生物类：基因检测传感器
08 指纹类：光学式指纹，电容式指纹
09 热学类：温湿度传感器，温度传感器
技术能力
TSV, RDL, WLCSP, Wafer tevwel bonding, Strip level bonding FC+WB stack die, Coating protection Metal lid attach,
Glass attach Compression molding Customize molding Clear molding, Open molding Can supply ceramic, lead frame,
substrate solutions, various assembly proposal fulfill customer requirements.
应用领域
手机，平板电脑，智能穿戴，医疗服务，工业生产，汽车电子等多种领域。
代表产品
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Cap Mount Product
Specification:
Package Size: 4030,3526,3729,3722,2718
Port Location: Top / Bottom
Cap Type: Metal / Plastic / SubstrateApplication:
Silicon Microphone, Pressure Sensor -
Customized Mold Product
Specification:
Package Type: QFN / LGA
Mold Type: Full Open Mold / Partial Open MoldApplication:
THTB, Optical Sensor, Heart rate sensor etc. -
Over Molding Product
Specification:
Package Type：QFN / LGA
Die Attach Orientation: Horizontal(0° or 180°） / Vertical （90°）Application:
G-sensor, AMR/TMR , Multi-axis Inertial
sensor，RF Filter -
Finger Print Sensor
Specification:
Package Type: QFN / LGA
Mold clearance : Min. 50 um(Over Molding)
Wire loop：Max 30um
Package thickness：Min 0.5mm
Package Outline: Rectangle / CircleApplication:
Mobile Phone, Credit Card , Door Lock,
Suitcase, ID Card etc.